Microanalysis and Microscopy: Applications

Semiconductor Analysis

We have an extremely comprehensive semiconductor analysis facility. From ion milling, which is used to reveal inner structures, to thin-film analysis on semiconductor surfaces, we have the tools to find the answers to problems with semiconductors, metal substrates, thin films, multilayer samples, and coatings. All semiconductor processes, including surface processes, film growth, bonding, and surface cleaning and etching can be fully analyzed.

In the development of 3D circuit technologies, the development of interconnections between the stacked circuitry is critical. Connecting vias (tiny microcircuitry holes filled with conducting material) ranging in size from hundreds of microns to less than 10 microns are routinely analyzed by our scientists. The vias are cross-sectioned to reveal problems with insulating and conducting thin films.

Contact: Dana Fox