Electronics: Capabilities
Testing and analysis
Our analytical scientists command a diverse range of techniques to assist you with your materials characterization needs. We can help answer your questions about defects, failure analysis, thin-film composition and microstructure, semiconductor characterization, surface topography, and other materials properties.
Our analytical techniques can provide the following information:
- Surface elemental analysis
- Surface chemical bonding
- Depth profiling
- Bulk elemental analysis
- Film thickness and optical constants
- Surface morphology and roughness
- Microscopy and imaging
- Radiographic analysis
Our electronics testing and analysis facilities have a proven track record that includes work in adhesives, biomedicines, chemicals, flat panel displays, integrated circuit packaging, lighting, microelectromechanical systems, nanotechnology, non-ferrous metals, optical disk drives, polymers, powdered metals, semiconductors, steel, and textiles.
Contact: Michael Lamvik