Electronics: Capabilities

Electronic Packaging and Assembly

As an extension of our work in the analysis and fabrication of novel materials, we research and develop innovative solutions in electronic packaging and assembly. Our technical staff work directly with clients to help them meet a variety of requirements, such as the following:

Ultra fine-pitch flip chip bumping
Fine-pitch flip chip assembly
Fluxless soldering and assembly using plasma-assisted dry soldering (PADS) technology
Micro-electromechanical systems (MEMS) packaging
Reliability testing

For more information, see 3-D Microsystem Integration.

Contact: Alan Huffman