Electronics Research and Development

Superlattice thermoelectric modules used to develop an experimental heat-to-electric power conversion system

We conduct basic and applied research in the field of electronics. We develop electronic components and devices, devise novel semiconductor and insulating materials, and analyze client materials. Our engineers have developed novel ways to integrate dissimilar materials—especially active semiconductors—using wafer-bonding technology.

Focus Areas

Capabilities

  • Ion mill
  • Materials deposition: spin coating, sputter deposition, CVD, e-beam evaporation, and electroplating
  • High-temperature processing
  • Packaging and assembly
  • Nanoscale device processing and device architectures

Facilities and Instrumentation

  • Scanning electron microscopy (SEM)
  • Atomic force microscopy (AFM)
  • X-ray photoelectron spectroscopy (XPS)
  • Auger electron spectroscopy (AES)
  • Energy dispersive spectroscopy (EDS)
  • Wavelength dispersive spectroscopy (WDS)
  • Fourier transform infrared (FTIR) spectroscopy
  • Ellipsometry

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