Electronics Research and Development
We conduct basic and applied research in the field of electronics. We develop electronic components and devices, devise novel semiconductor and insulating materials, and analyze client materials. Our engineers have developed novel ways to integrate dissimilar materials—especially active semiconductors—using wafer-bonding technology.
Focus Areas
- Sensors and Systems
- 3-D Microsystem Integration
- Optoelectronic Devices
- Organic and Flexible Electronics
- Micro Power Sources
- Thermal Management
- Sensor Power and Packaging Technologies
Capabilities
- Microfabrication and prototyping
- Electronic systems development and prototyping
- Design and modeling
- Testing and analysis of integrated circuits and displays
- Materials engineering
- Photolithography with resolution to 0.5 microns
- Wet, reactive ion, and deep silicon etch
- Ion mill
- Materials deposition: spin coating, sputter deposition, CVD, e-beam evaporation, and electroplating
- High-temperature processing
- Packaging and assembly
- Nanoscale device processing and device architectures
Facilities and Instrumentation
- Scanning electron microscopy (SEM)
- Atomic force microscopy (AFM)
- X-ray photoelectron spectroscopy (XPS)
- Auger electron spectroscopy (AES)
- Energy dispersive spectroscopy (EDS)
- Wavelength dispersive spectroscopy (WDS)
- Fourier transform infrared (FTIR) spectroscopy
- Ellipsometry
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