Sensor Power and Packaging Technologies
Beyond energy efficiency, advanced thermoelectric technologies using modern semiconductor tools and electronics packaging methods, have a role in harnessing low-grade waste heat for a broad set of sensor applications.
Our thin-film superlattice thermoelectric power devices can achieve high specific power (in W/cm2 or W/cc) and can harness power at temperature differentials as small as 1°C. These features enable thermal energy harvesters with high-efficiency DC-DC conversion technologies that can be applied to pacemakers, neural implants, and other sensors and bio-applications. By making such devices more efficient, fewer invasive surgeries would be required to replace power sources.
Our technologies can also enable novel biomedical applications, including treatments for Parkinson's disease and other disorders, that require low-voltage power sources.
Research Citations
- C. David Stokes, Eric A. Duff, Mike J. Mantini, Brian A. Grant, Philip P. Barletta, and Rama Venkatasubramanian (2010). Thin-film superlattice thermoelectric materials and device technologies for energy harvesting applications. Proceedings of the SPIE 7683 (76830W) (Apr. 28, 2010).
- Venkatasubramanian, R., Watkins, C., Stokes, D., Posthill, J., & Caylor, C. (2007). Energy harvesting for electronics with thermoelectric devices using nanoscale materials. International Electron Devices Meeting 2007. IEEE International, Washington, DC, 367-370.
- Venkatasubramanian R (2010). DC-DC converter for low voltage power source. U.S. Patent No. 7,706,152. Washington, D.C.: U.S. Patent and Trademark Office.
Contact us for more information
- Charles D. Stokes