Microsystem Integration and Packaging
Microsystems are the building blocks of information technology and include such technologies as microelectronics or integrated circuits (ICs), photonic and optoelectronic ICs, and microelectromechanical systems (MEMS). Integration and packaging of these microsystems has been a core activity of RTI researchers for more than 25 years.
We have built client-based solutions for government and industry alike and collaborated with commercial and academic partners on applications such as high-performance sensor and actuator arrays, biomedical devices, and high-performance computing. Our advanced technologies infrastructure includes a state-of-the-art microfabrication facility offering fabrication and development services and analytical lab services for materials imaging and analysis.
Focus Areas
- 3D integration technologies
- Advanced interconnect and packaging (flip chip and wafer-level processing)
- Post-CMOS wafer processing
Related Research
