Fabrication and Development

RTI International is a leader in the research, development, and prototyping of innovative materials, microstructures, and devices. Our labs are equipped with a wide variety of tools and processing capabilities. Currently, we are focused on the development of numerous materials and electronics technologies, including:

Sensors and actuators
3-D interconnect technologies
Biomaterials
Photonics and optoelectronics
Organic light-emitting devices (OLEDs)
Micro-electromechanical systems (MEMS) devices
Flexible displays and electronics
Advanced electronic packaging solutions

RTI specializes in custom fabrication and prototyping services, and our team is ready to assist with your most challenging development projects. Our labs are professionally staffed and managed by highly trained and experienced technical personnel. For additional related information, see Analytical Lab Services.

Fabrication Services Capabilities

Photolithography		Thin and thick resists (positive and negative) Contact and proximity alignment/exposure Back side alignment 5X reduction stepper

Etching		Wet etching of oxides and metals Anisotropic wet etching of silicon Dry etching of oxides, nitrides, and polymers Ion milling of metal films and stacks High aspect-ratio deep silicon RIE

Thin-film deposition		Electron beam evaporation of metals DC/RF sputtering of metals & dielectrics PECVD oxides and low stress nitrides MOCVD conformal copper films

Specialty coatings		Spin-on polymers (polyimides, BCB, PVDF, etc) Parylene organic dielectric films Plated metals Molecular vapor deposition (self-assembled monolayers)

Thermal processing		Bakes and cures for resists and polymers High-temperature furnace anneals

Inspection & metrology		Optical microscopy 4-pt resistivity mapping Ellipsometry and reflectometry Film stress measurements Profilometry White light interferometry

Back-end processing		Solder bumping Flip chip alignment and bonding Packaging and assembly

Testing capabilities		I-V and C-V measurements Optical characterization Reliability testing Materials testing

Most of our processes are able to handle a variety of wafer materials and sizes (up to 8 inches). We can usually accommodate small samples and special substrate geometries. To learn more about our advanced packaging and interconnect technologies, see 3-D Integration and Electronic Packaging.

Thomas E. Kindl
tkindl rti.org
919-248-1404