Electronics Research and Development
We conduct basic and applied research in the field of electronics. We develop electronic components and devices, devise novel semiconductor and insulating materials, and analyze client materials. Our engineers have developed novel ways to integrate dissimilar materials—especially active semiconductors—using wafer-bonding technology.
Focus Areas
- Thermal Management
- Micro Power Sources
- Sensor Power and Packaging Technologies
- Optoelectronic Devices
- 3-D Microsystem Integration
- Sensors and Systems
- Organic and Flexible Electronics
Capabilities
- Microfabrication and prototyping
- Electronic systems development and prototyping
- Electronic packaging and assembly
- Testing and analysis
- Design and modeling
- Materials engineering
- Photolithography with resolution to 0.5 microns
- Wet, reactive ion, and deep silicon etch
- Ion mill
- Materials deposition: spin coating, sputter deposition, CVD, e-beam evaporation, and electroplating
- High-temperature processing
- Nanoscale device processing and device architectures
Facilities and Instrumentation
- Scanning electron microscopy (SEM)
- Atomic force microscopy (AFM)
- X-ray photoelectron spectroscopy (XPS)
- Auger electron spectroscopy (AES)
- Energy dispersive spectroscopy (EDS)
- Wavelength dispersive spectroscopy (WDS)
- Fourier transform infrared (FTIR) spectroscopy
- Ellipsometry
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Sixth International Conference on 3-D Architectures for Semiconductor Integration, Packaging Announced
The 2009 3-D Architectures for Semiconductor Integration and Packaging Conference and Exhibition will bring together industry leaders to examine the practical and competitive landscape on the path to implementation of 3-D integration and packaging technologies Dec. 9-11, 2009, in Burlingame, Calif.