3-D Microsystem Integration
We are developing technologies for 3-D integration of microfabricated devices and components. This work is supported by extensive process and material analysis infrastructure. Key technologies include
- Through-silicon vias (TSVs) and through-silicon interconnects (TSIs)
- Aligned bonding of die and wafers using polymers and metals, including high-density flip-chip and microbumping
- High-density, multilevel metal dielectric structures on passive and active semiconductor substrates
- Silicon wafer thinning
- Technologies for integrated passive devices
In collaboration with commercial and academic partners, we are pursuing a variety of technology applications, including
- High-performance sensor and actuator arrays
- Biomedical devices
- High-performance computing
rti.org