RTI International - News Release - 10.1.2009

Implementation of 3-D IC Technology to Be Highlighted at San Francisco Conference

The conference, organized by RTI International, will take place in San Francisco Dec. 9–11

RESEARCH TRIANGLE PARK, N.C.—Industry leaders will speak at RTI International's fourth international conference "3-D Architectures for Semiconductor Integration and Packaging" in San Francisco Dec. 9-11.

Held annually since 2002, this conference series has become recognized as the premier gathering of senior technologists and business leaders involved in 3-D integration and packaging.

This year's event features nearly 30 invited speakers during the conference and pre-conference symposium, presenting on the impact of the latest technology and market developments.

Included are distinguished keynote presentations from Jerry Bautista, director of technology management, Microprocessor Research Laboratory, Intel; Douglas Yu, senior director of Integrated Interconnect and Packaging, TSMC; John Knickerbocker, distinguished engineer manager, System on Package and 3-D Integration, IBM; Ho-Ming Tong, chief R&D officer and general manger of group R&D, ASE Group; Raj Pendse, vice president, Technology Group, STATS ChipPAC; Ron Huemoeller, vice president, Advanced Interconnect, Amkor Technology.

This year's conference will provide attendees and speakers the unique opportunity to explore and understand the technology and business implications of the trend toward 3-D device and system integration in the semiconductor industry.

Conference sessions for this year's event include:

• The IDM and Foundry Perspective on 3-D Technology Trends and Opportunities
• The Packaging Foundry and Its Vital Role in Driving 3-D
• Looking Over the Horizon—Forecasting Growth
• On the Front—Applications Driving 3-D Development and Commercialization
• Taking Advantage of 3-D—Rethinking Design Approaches
• Industry- and Government-Funded 3-D Efforts—Key Research Outcomes and Resources
• Fundamental Technology Approaches to Building 3-D
• Wafer Handling Leads the Way on Manufacturing

The conference targets senior-level technologists, managers, and business executives from the international semiconductor community. It addresses a full range of interests for designers, manufacturers, suppliers, and end users. Additional program information is available at http://techventure.rti.org.

The conference is a part of RTI's Technology Venture Forum Series, which seeks to provide insight on the impact of significant emerging technologies. Additional information on the conference can be obtained at the Technology Venture Forum series Web site, or contact

Matthew Mecray, RTI International
  phone: 207-829-6084
  fax: 207-829-4024
  e-mail: mmecray@rti.org