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06.02.2009
The 2009 3-D Architectures for Semiconductor Integration and Packaging Conference and Exhibition will bring together industry leaders to examine the practical and competitive landscape on the path to implementation of 3-D integration and packaging technologies Dec. 9-11, 2009, in Burlingame, Calif.
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03.17.2009
RTI International hired Lynn Soby as vice president of operations for its Engineering Technology Unit.
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12.11.2006
David Myers, vice president of RTI International's Engineering and Technology Unit, has been appointed to serve on the Cleaner Fossil Fuels Committee of the World Energy Council.
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1-20 of 74 news releases were found related to Electronics.«back» 1 2 3 «next» «sort by Title»
RTI International Dedicates New $20 Million State-of-the-Art Science & Engineering Building
–09.27.2006
RTI International to Hold "3D Architectures for Semiconductor Integration and Packaging" Conference
–05.15.2006
Conformal 'Paint-On' Antennas to Transform High-Altitude Airships into Communication, Surveillance Platforms
–01.12.2006
RTI International, InnerOptic Technology Inc. Awarded Grant to Improve 3D Surgery Technology
–08.18.2005
RTI Spin-off Nextreme Thermal Solutions Wins Technology of the Year Award from Entrepreneurial Council
–06.16.2005
RTI International Completes Acquisition of MCNC Research & Development Institute Divisions
–03.14.2005
Semiconductor Industry Leaders to Participate in 3-D Chip Integration, Packaging Conference
–03.01.2004
RTI Spinoff Ziptronix Raises Venture Capital
–05.29.2003
RTI's Thermoelectrics Innovation in the News
–08.27.2002
Ziptronix Names New CEO
–01.14.2002
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